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Materials | Processes | Process Specs | Quality |
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| Copper Clad Laminate |
Rolled annealed and electro-deposited copper; Acrylic, modified acrylic, and modified epoxy adhesive; Polyimide; UL-rated. |
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| Coverlayer |
Acrylic, modified acrylic, and modified epoxy adhesive; Polyimide; UL-rated. |
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| Adhesive |
Acrylic, modified acrylic, and modified epoxy; UL-rated. |
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| Soldermasks |
Flexible LPI; Green and brown color. |
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| Stiffeners |
Polyimide, FR4, PEN, stainless steel, and aluminum. |
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| Pressure Sensitive Adhesive |
Non-conductive and conductive (Z-Axis and X/Y/Z-Axes). |
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