Listed below are some of our various PCB manufacturing capabilities. |
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| Materials |
FR4, high Tg FR4, halogen-free, and high frequency. |
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| Drill Holes |
Standard technology DIA 0.008" [0.20mm] plated-through via holes (conventional) and blind/buried DIA 0.004" [0.10mm] plated via holes (laser). |
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| Hole Aspect Ratio |
Mass production ready at 6:1, but capable upto 8:1. |
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| Lines & Spaces |
0.005"/0.005" [0.13mm/0.13mm] for outer layers and 0.004"/0.004" [0.10mm/0.10mm] for inner layers. |
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| Automatic Inspection |
AOI available for all etched layers. |
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| Minimum SMT Pitch |
0.012" [0.30mm] pitch for mass production, but capable upto 0.008" [0.20mm] pitch. |
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| Soldermask |
Liquid photo-imageable. |
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| Surface Plating |
Hard gold, immersion gold, HASL, carbon ink, OSP, immersion tin, and immersion silver. |
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| Layer Count & Thicknesses |
6 to 18 layers with board thicknesses ranging from 0.004" [0.10mm] to 0.126" [3.20mm]. |
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Note: The specifications above are standard for our high volume part manufacturing. Please contact us directly if you have inquiries about our other manufacturing or R&D capabilities. |
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